OmniVision’s VGA CameraCubeChip™ takes full advantage of our OmniPixel3-HS™ (High Sensitivity) and OmniBSI™ pixel architectures with automatic image control functions and ultra low power requirements. Its unique wafer level assembly combines the sensor with wafer level optics that are optimized for system level performance. This approach produces efficient, cost-effective VGA CameraCubeChip that achieves industry-leading compactness (down to 2.4 X 2.4 X 2.3 mm).

As with any other surface mount device, OmniVision’s CameraCubeChip can be directly soldered to the printed circuit board with no socket or insertion required, thus eliminating the need for additional components. This reduction in the bill of materials and ease of integration results in reduced cost and faster time-to-market. The device can withstand reflow temperatures up to 245° C and has successfully completed full conformance testing, including drop test, and reliability.

The VGA CameraCubeChip is available for volume production directly from OmniVision.

OVM7692
Package	Resolution	Optical Format	Frame Rate	Pixel Size	Output Format	Package Size	Chroma	Power Consumption	Product Brief
25-pin CSP	VGA	1/13"	60 @ QVGA 30 @ CIF 30 @ Full	1.75 µm	RAW RGB, RGB, YUV	2835 x 3199 x 2472 µm	Color	Standby: 23 µA Active: 120 mW
OVM7695
Package	Resolution	Optical Format	Frame Rate	Pixel Size	Output Format	Package Size	Chroma	Power Consumption	Product Brief
Black Coating	VGA	1/13"	120 @ QQVGA 60 @ QVGA 30 @ Full	1.75 µm	YUV	2420 x 2350 x 2338 µm	Color	TBD
Metal Can	VGA	1/13"	120 @ QQVGA 60 @ QVGA 30 @ Full	1.75 µm	YUV	2440 x 2640 x 2370 µm	Color	TBD