OmniVision’s CameraCube™ devices are an all-in-one camera solution combining integrated wafer level optics onto chip-scaled-packaged CMOS image sensors. CameraCube technology combines the full functionality of a single-chip image sensor, embedded image processor, and wafer-level optics into one compact, reflowable, small-footprint package.

OmniVision’s CameraCube devices take full advantage of our OmniPixel3-HS™ (High Sensitivity) technology with automatic image control functions and ultra low power requirements. OmniVision’s unique wafer level assembly combines the sensor with wafer level optics optimized for system level performance in the industry’s smallest total camera package (down to 2.5 X 3.0 X 2.5 mm).

As with any other surface mount device, CameraCube devices can be directly soldered to the printed circuit board with no socket or insertion required; thus eliminating the need for additional components. This reduction in the BOM and ease of integration results in reduced cost and faster time-to-market. CameraCube devices withstand reflow temperatures up to 260° C and have achieved full conformance testing, including EMI, ESD, drop test, and reliability. CameraCube devices are available for volume production direct from OmniVision.

OVM7690
Package	Resolution	Optical Format	Frame Rate	Pixel Size	Output Format	Package Size	Chroma	Power Consumption	Product Brief
20-pin Module	VGA	1/13"	60 @ QVGA 30 @ Full	1.75 µm	RAW RGB, RGB, YUV	2517 x 2967 x 2465 µm	Color	Standby: 20 µA Active: 100 mW
OVM7692
Package	Resolution	Optical Format	Frame Rate	Pixel Size	Output Format	Package Size	Chroma	Power Consumption	Product Brief
25-pin Module	VGA	1/13"	60 @ QVGA 30 @ Full 30 @ CIF	1.75 µm	RAW RGB, RGB, YUV	2835 x 3199 x 2472 µm	Color	Standby: 23 µA Active: 120 mW