Full High Definition 144 Hz AMOLED Driver IC for Smartphone Displays

Single chip FHD+ AMOLED solution (up to 1284 x 2800 with SPR)

2568ch source outputs

32ch programmable GIP control signals
– Support dual power domain for LTPO panel
– Separated configurable power domain
– Separated configurable slew-rate
– Separated configurable EQ time

SPR
Built-in delta-RGB/GGRB/Diamond sub-pixel rendering function

VESA DSC 1.2a decompression function

Display mode
– Up to 144 fps dynamic frame rate control with QSYNC support
– Video/command mode seamless switching
– Command mode with internal 1/3 or 1/3.75 compressed GRAM (1284*2800*24bpp*1/3 or 1284*2800*30bpp*1/3.75)

In-house 1/3 compression/decompression function

Interface
– Up to 1.5 Gbps*4 lane (D-PHY)
– Up to 0.9 Gsps*3 trio (C-PHY)
– Support SWIRE/SPI/I2C interface for external PMIC
– Dual SWIRE interface: A-SWIRE and E-SWIRE
– Support 1-bit/2-bit/4-bit SPI-flash interface

Round corner/notch process

Local HBM for customized shape and region

Separate gamma and gamma transition for customized UDC/local HBM region and shape

IR-drop compensation
– Dynamic global IR-drop compensation
– Static local IR-drop compensation
– Content adaptive IR-drop compensation

Demura
– Support 1×1 demura with 8x ~ 16x compression

Gamma
– Individual gamma curve for R/G/B
– Separate gamma table for UDC/HBM
– Gamma interpolation for transition zone

Brightness control
– PWM brightness control
– DC brightness control
– Gamma interpolation with DBV support
– Digital data mapping

Support temperature compensation for ELVSS with internal temperature sensor

Support AOD mode with internal generated ELVDD/ELVSS

Power saving function
– ACL (auto current limitation)
– Dynamic ELVSS control
– Blanking off

Color enhancement
– Color space management
– Color temperature adjust
– Saturation enhancement
– Sharpness enhancement
– Brightness enhancement
– Skin-tone and local hue adjustment

16KB built-in OTP memory

Package: COP

Die size: 32910 x 1570 x 170 µm