12" Wafer-Based 2‑Megapixel Image Sensor for Entry Level and Mainstream Mobile Cameras

OMNIVISION’s OV02B is the latest member of its 2‑megapixel (MP) image sensor family. The OmniPixel®3‑HS architecture provides this sensor with a 1.75 micron pixel pitch in a 1/5″ optical format. The OV02B is built on 12″ wafers while maintaining a die size that is comparable to our existing 2MP sensors, offering an effective alternative to 8″ wafer-based sensors for cost sensitive entry level and mainstream smartphones.

Building on the success of its predecessor, the OV02A, while maintaining the same cost, the OV02B has an added SCCB ID (SID) pin, which provides two available hardware I2C addresses to meet the requirements of multicamera applications. It also adds a hardware strobe pin to sync LED flash photography, along with 32 bytes of on-chip OTP memory for storing automatic white balance (AWB) and manufacturer production information. Using a Bayer pattern, it supports both color and monochrome, while also providing a chief ray angle (CRA) of up to 30.69°.

The OV02B is designed for the main and front-facing bokeh cameras in entry level and mainstream smartphones where 2MP has become the industry standard. It also provides a cost-effective solution for the main tablet and notebook cameras. Output formats include 1600 x 1200 at 30 frames per second (fps) and 800 x 600 at 60 fps.

February 19, 2020: OMNIVISION Expands 2‑Megapixel Image Sensor Supply With New 12″ Wafer-Based Sensor for Entry Level and Mainstream Mobile Cameras