New Full High Definition 144 Hz Touch and Display Driver Integration for Next-Generation Smartphones

Touch Features

Multi-touch coordinate sensing without ghost points
– Voltage correction circuits enhance the sensitivity (supporting automatic calibration)

RISC CPU optimized for capacitive sensing and other human interaction

Supports up to 18×36 electrodes to provide the highest possible accuracy

– Analog front ends (AFEs) support up to 648 receiver pads

Supports I2C and SPI with OMNIVISION TouchComm protocol for communication with the host

Proprietary intelligent algorithms, run locally on the CPU facilitate the removal of mechanical buttons and switches, which increases reliability and reduces footprint and component cost

Low power sensing modes enable wake-up gesture functionality

Face-detect proximity capability reduces cost by eliminating the need for other proximity sensing components

Display synchronization and increased voltage capability enable improved performance over discrete touch implementations

Programmable sensing speed of 50 kHz to 500 kHz to minimize noise interference

Includes support to control segmented VCOM in-cell touch scanning circuits and enable ultra-thin, low-cost integrated sensing schemes

High signal-to-noise ratio (SNR) touch AFE improves touch performance

144/120/90/60 Hz long H-blank or V-blank sensing

Low power wake-up gesture (LPWUG)

Display Features

16.77M colors (24 bpp data format) single chip driver for a 1024-grayscale TFT with a resolution of 1080 RGB x 2520-dot graphics (with power supply circuits and supporting low temperature poly-silicon (LTPS) panel)

4-lane/1-port MIPI DSI-2 D option interface for high-speed and low power transmission in both directions with low EMI noise (DSI-2 1.0, D-PHY1.3, DCS 1.2)

3-lane/1-port MIPI DSI-2 C option interface for more high-speed and low power transmission in both directions with fewer data lane number and low noise (DSI-2 1.0, C-PHY1.3, DCS 1.2)

Digital pixel processing
– Digital GAMMA for RGB separate gamma correction function
– Content adaptive backlight control (CABC)
– Color enhancement (CE) with color space management
– Sunlight Readability Enhancement function (SRE)
– Outline sharpness function
– Local area Auto Contrast Optimization function (LCO)
– Paper mode

Low-power consumption architecture (allowing direct input of the interface I/O power supply)
– Input power supply voltage: Interface and logic power supply: IOVCC Analog power supply: VSP, VSN MIPI D-PHY power supply: DPHYVCC MIPI C-PHY power supply: DPHYVCC

Internal liquid crystal drive power supply circuit
– Source driver and VCOM: VSP-AGND and VSN-AGND
– DC power supply for VCOM drive: VCI-VCL
– Interface to the panel: VGH-AGND and VGL-AGND
– Interface to the panel: SOUT1-48
– Liquid crystal panel drive circuits: 1080 source signal lines (three multiplexers)
– One-chip solution for a chip-on-film (COF) module
– Internal NVM: VCOM can be rewritten up to eight times
– Dummy pins are opened
– Chip substrate: Connected to the VSUB, the negative voltage of the chip. Put the isolation tape between the ASIC and the LCM bezel to prevent the substrate from contacting the inappropriate side