![](https://www.ovt.com/wp-content/uploads/2022/01/CameraCubeChip_Hero-scaled.jpg)
CameraCubeChip®
OMNIVISION’s CameraCubeChip® integrates image sensors, processor and lenses in a miniature wafer-level camera module
Technology Benefits
Fully integrated components enable ultra-thin, compact devices with advanced imaging capability.
![](https://www.ovt.com/wp-content/uploads/2021/03/GettyImages-11747129901-scaled.jpg)
![](https://www.ovt.com/wp-content/uploads/2021/03/GettyImages-1204740322-e1691174836365.png)
Technology Features
CameraCubeChip® incorporates advanced image-sensor technology into a wafer-level chip-scale package.
-
CMOS Image SensorsThe CameraCubeChip® leverages both OMNIVISION’s frontside–illuminated and backside-illuminated CMOS image-sensor technology.
-
Wafer-Level OpticsCameraCubeChip® applies semiconductor stacking methodology to fabricate wafer-level optical elements as wafer structure layers.
-
Chip-Scale PackagingOMNIVISION’s wafer-level chip-scale packaging expertise provides a simplified supply chain with standard surface mount handling.
Applications
The CameraCubeChip® delivers miniature-camera solutions to the medical, AR/VR and mobile markets.
Product Solutions
OMNIVISION places its customers at the leading edge of imaging technology with its commitment to innovative, forward-thinking solutions.