Digital cameras represent a complex system of optics, image sensing circuitry, packaging, digital image processing and software. World-class performance requires cutting-edge technology in every individual area as well as deep knowledge of the overall system design. This comprehensive knowledge is what sets OmniVision apart and allows it to consistently deliver leading-edge technology to improve digital image capture.
Pixel TechnologiesOmniVision’s first-to-market OmniBSI™ pixel technology literally turns the imaging world upside down. OmniBSI uses backside illumination light sensing to deliver ultra high-quality sensors among the highest resolutions available and in the smallest form factors. OmniBSI’s ability to continue shrinking pixel geometries without compromising image quality or low-light performance makes it ideal for all mobile applications, as well as any other market looking for ultra-compact, high-performance camera solutions.
OmniBSI-2™ is OmniVision’s second-generation backside illumination (BSI) pixel architecture and the world’s first 1.1-micron BSI pixel. It represents a major milestone in digital imaging technology, enabling advanced imaging solutions with superior image quality and low-light sensitivity. OmniBSI-2 technology is built using advanced 65 nm design rules, which allow OmniVision to extend its pixel roadmap to sub-micron levels, a key enabler in the continuous miniaturization of digital imaging technology.
OmniPixel3-HS™ pixel technology is ideally suited for sensor solutions that allow for larger pixels, providing exceptional sensitivity, low noise, high dynamic range, and low-light performance. This high-sensitivity pixel architecture addresses the market requirements of camera phones, notebooks/netbooks, medical devices, security cameras and automotive vision systems.